Disclosure Information: Detailed information about hedging instruments
   
Label: Detailed information about hedging instruments
Name: DetailedInformationAboutHedgingInstruments
Type: Disclosure
Parent Topic: OtherFinancialStatementAccounts
Documentation: The disclosure of detailed information about hedging instruments. [Refer: Hedging instruments [member]]
Commentary:
Text Block Name: ifrs-full:DisclosureOfDetailedInformationAboutHedgingInstrumentsExplanatory
SEC Level: Disclosure
Concept arrangement pattern: [Hierarchy]
Completion state:
Status: OK
Standards: IFRS---
Exemplars: 22 examples
Taxonomy Network:
Prototype for disclosure: Machine Readable
Line Label Object Class (Data type) Period Type Balance Report Element Name
Business Rules for Disclosure: Controlled Natural Language 
Rules for disclosure: DetailedInformationAboutHedgingInstruments 
This disclosure:

   - MUST be represented as an SEC 'Level' (i.e. Document, Statement, Disclosure, Schedule) type: Disclosure
Business Rules for Disclosure: Machine-Readable
From Arcrole (predicate) To
DetailedInformationAboutHedgingInstruments disclosure-isSECType Disclosure
Exemplars for Disclosure: Machine-Readable
Entity Name and Text Block or Detailed Disclosure
AMBEV S.A. | Atento S.A. | AU OPTRONICS CORP | BANCOLOMBIA SA | CELESTICA INC | CEMENTOS PACASMAYO SAA | CHUNGHWA TELECOM CO LTD | Controladora Vuela Compania de Aviacion, S.A.B. de C.V. | CREDICORP LTD | ECOPETROL S.A. | GLAXOSMITHKLINE PLC | INTERTAPE POLYMER GROUP INC | LATAM AIRLINES GROUP S.A. | MAZOR ROBOTICS LTD. | MEXICAN PETROLEUM | NATIONAL WESTMINSTER BANK PLC /ENG/ | PRIME ACQUISITION CORP | Scorpio Tankers Inc. | SK TELECOM CO LTD | TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD | Ternium S.A. | UNITED MICROELECTRONICS CORP |

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Last updated: 12/20/2019 6:50:01 PM